The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Nov. 14, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Kurt Kramer Schleif, Greenville, SC (US);

Donald W. Shaw, Simpsonville, SC (US);

Zachary John Snider, Simpsonville, SC (US);

Mario Joseph Arceneaux, Simpsonville, SC (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H05K 7/1432 (2013.01);
Abstract

A system for dissipating thermal energy from electronic components disposed within a rotatable shaft includes an annular carrier shaft having one end formed to couple to an end of a rotor shaft. The system also includes a transmitter assembly. The transmitter includes an outer casing, a daughter board and a circuit board electronically coupled to the daughter board within an inner pocket of the transmitter housing. The circuit board comprises a strip of thermally conductive material. The transmitter assembly further includes a lid that at least partially seals the inner pocket. A contact surface of the lid is in thermal communication with the thermally conductive material of the circuit board and at least a portion of a top surface of the lid is thermally coupled to an inner surface of the carrier shaft during rotation thereof. A method for dissipating thermal energy away from the circuit board is also provided.


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