The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jul. 17, 2013
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Yoshinori Sunaga, Hitachinaka, JP;

Yoshiaki Ishigami, Hitachi, JP;

Kinya Yamazaki, Hitachi, JP;

Hidenori Yonezawa, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); G02B 6/4269 (2013.01); H01L 23/473 (2013.01); G02B 6/4214 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.


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