The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jun. 20, 2014
Applicant:

Merry Electronics (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Jen-Yi Chen, Taichung, TW;

Chao-Sen Chang, Taichung, TW;

Chun-Chieh Wang, Taichung, TW;

Yong-Shiang Chang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 1/28 (2006.01); H04R 1/04 (2006.01); B81B 7/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/28 (2013.01); B81B 7/0032 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48221 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01);
Abstract

A multi-floor type MEMS microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity. A MEMS transducer is disposed in the second cavity and electrically conducted with the housing, and an ASIC chip is disposed in the first cavity and electrically conducted with the housing. By this design, the volume of the back chamber of a vibrating diaphragm of the MEMS transducer can be increased in a limited space of the housing, and thus the sensitivity of the microphone can be improved.


Find Patent Forward Citations

Loading…