The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Oct. 20, 2011
Applicants:

Takashi Nakagami, Tokyo, JP;

Koji Nakano, Tokyo, JP;

Hiroyuki Kamitani, Tokyo, JP;

Takayuki Takashige, Tokyo, JP;

Inventors:

Takashi Nakagami, Tokyo, JP;

Koji Nakano, Tokyo, JP;

Hiroyuki Kamitani, Tokyo, JP;

Takayuki Takashige, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 9/22 (2006.01); H02K 11/04 (2006.01); F04B 39/12 (2006.01); F04B 53/08 (2006.01); H02K 11/00 (2006.01); H02K 5/22 (2006.01); F04C 23/00 (2006.01); F04C 29/04 (2006.01); F04C 18/02 (2006.01);
U.S. Cl.
CPC ...
H02K 11/044 (2013.01); F04B 39/121 (2013.01); F04B 53/08 (2013.01); F04C 23/008 (2013.01); F04C 29/047 (2013.01); H02K 5/22 (2013.01); H02K 11/0073 (2013.01); F04C 18/0215 (2013.01); F04C 2240/808 (2013.01); H02K 9/22 (2013.01);
Abstract

A control circuit board () configuring an inverter () serves as a thermally-conductive substrate. One surface of the control circuit board () is installed in a heat transferable manner on a heat-dissipating planar part () disposed on a housing (), while heat-producing electrical components () are disposed in a heat transferable manner on the other surface of the control circuit board (). The control circuit board () includes a substrate body () constituted of an insulator, and heat-conducting through members () constituted of a good thermal conductor filled through in a thickness direction of the substrate body (). One end of each of the heat-conducting through members () is disposed in a heat transferable manner on the heat-dissipating planar part (), and the electrical component () is disposed in a heat transferable manner on the other end.


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