The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jun. 01, 2010
Applicants:

Atsuo Michiue, Anan, JP;

Yasuhiro Kawata, Anan, JP;

Inventors:

Atsuo Michiue, Anan, JP;

Yasuhiro Kawata, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01S 5/22 (2006.01); H01S 5/042 (2006.01); H01S 5/02 (2006.01); H01S 5/323 (2006.01);
U.S. Cl.
CPC ...
H01S 5/22 (2013.01); H01S 5/0425 (2013.01); H01S 5/0213 (2013.01); H01S 5/0218 (2013.01); H01S 5/2205 (2013.01); H01S 5/32341 (2013.01); H01S 2301/176 (2013.01);
Abstract

A semiconductor device includes a semiconductor layer stacked on a substrate, a stripe-shaped ridge formed on a surface of the semiconductor layer, and electrode formed on an upper surface of the ridge and a protective film disposed on each side of the ridge. The electrode includes a flat portion having a flat surface substantially parallel to the upper surface of the ridge and sloped portions on both sides of the flat portion with each of the sloped portions having a sloped surface that is sloped with respect to the upper surface of the ridge. The protective film covers a region from a side surface of the ridge to the sloped surface of the sloped portion of the electrode.


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