The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

May. 03, 2013
Applicants:

Emitec Gesellschaft Fuer Emissionstechnologie Mbh, Lohmar, DE;

Bayerische Motoren Werke Aktiengesellschaft, Munich, DE;

Inventors:

Andreas Eder, Munich, DE;

Stefan Neugebauer, Ohlstadt, DE;

Matthias Linde, Munich, DE;

Sigrid Limbeck, Much, DE;

Rolf Brueck, Bergisch Gladbach, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/28 (2006.01); H01L 35/32 (2006.01); F02G 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); F02G 5/00 (2013.01); Y02T 10/166 (2013.01);
Abstract

A thermoelectric module includes an inner circumferential surface, an axis and an outer circumferential surface. A plurality of semiconductor elements is disposed with thermoelectric material in the direction of the axis and between the inner circumferential surface and the outer circumferential surface and are electrically interconnected in an alternating manner. At least one part of the semiconductor elements has at least one inner frame part or an outer frame part. At least some of the inner frame parts form an interrupted inner circumferential surface or outer frame parts form an interrupted outer circumferential surface.


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