The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Sep. 14, 2012
Applicants:
Shinji Nunotani, Fukuoka-ken, JP;
Yasuhiko Akaike, Fukuoka-ken, JP;
Yoshinori Natsume, Kanagawa-ken, JP;
Kazuyoshi Furukawa, Kanagawa-ken, JP;
Inventors:
Shinji Nunotani, Fukuoka-ken, JP;
Yasuhiko Akaike, Fukuoka-ken, JP;
Yoshinori Natsume, Kanagawa-ken, JP;
Kazuyoshi Furukawa, Kanagawa-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/0079 (2013.01); H01L 33/405 (2013.01); H01L 33/60 (2013.01);
Abstract
According to one embodiment, a semiconductor light emitting element includes: a support substrate; a bonding layer provided on the support substrate; an LED layer provided on the bonding layer; and a buffer layer softer than the bonding layer. The buffer layer is placed in one of between the support substrate and the bonding layer and between the bonding layer and the LED layer.