The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jun. 25, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Shuichi Taniguchi, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); H01L 21/28008 (2013.01); H01L 27/11582 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01);
Abstract

A semiconductor device according to one embodiment includes a semiconductor substrate, a back-gate layer formed above the semiconductor substrate, and a stacked body formed above the back-gate layer and comprising a plurality of insulating layers alternately formed between a plurality of electrode layers. The lowermost electrode layer of the plurality of electrode layers contains metal, and remaining electrode layers of the plurality of electrode layers other than the lowermost electrode layer do not contain the metal. Furthermore, the semiconductor device includes a pair of columnar semiconductor layers penetrating the stacked body and a semiconductor layer connecting lower portions of the pair of columnar semiconductor layers, the semiconductor layer embedded in the surface of the back-gate layer.


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