The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Mar. 11, 2014
Applicants:
Hefei Boe Optoelectronics Technology Co., Ltd., Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Qingchao Meng, Beijing, CN;
Kiyoung Kwon, Beijing, CN;
Chengda Zhu, Beijing, CN;
Baoquan Zhou, Beijing, CN;
Assignees:
BOE Technology Group Co., Ltd., Beijing, CN;
Hefei BOE Optoelectronics Technology Co., Ltd., Anhui, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 27/12 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/1368 (2013.01);
Abstract
An array substrate, comprising: a substrate; a metal pattern formed on the substrate; an insulation layer formed on the metal pattern and formed with a via therein; and a transparent conductive pattern formed on the insulation layer and electrically connected to the metal pattern through the via, wherein the via has a cross section exhibiting an irregular geometry shape having a curved side edge.