The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jan. 30, 2015
Applicant:

International Rectifier Corporation, El Segundo, CA (US);

Inventors:

Robert Joseph Therrien, Apex, NC (US);

Jerry Wayne Johnson, Raleigh, NC (US);

Allen W. Hanson, Cary, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/48 (2006.01); H01L 29/20 (2006.01); H01L 29/872 (2006.01); H01L 23/00 (2006.01); H01L 29/786 (2006.01); H01L 29/78 (2006.01); H01L 33/32 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 24/89 (2013.01); H01L 29/2003 (2013.01); H01L 29/78 (2013.01); H01L 29/78681 (2013.01); H01L 29/872 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/351 (2013.01); H01L 2933/0016 (2013.01);
Abstract

Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others.


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