The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Sep. 26, 2013
Applicant:
Alcatel Lucent Canada, Inc., Ottawa, CA;
Inventors:
Stefano F. De Cecco, Ottawa, CA;
Gregory W. Cheshire, Woodlawn, CA;
Assignee:
Alcatel Lucent, Boulogne-Billancourt, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/42 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/4093 (2013.01); H01L 23/42 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink.