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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9318405 B1

PDFFull Text
Date of Patent:
Apr. 19, 2016

Filed:

May. 01, 2015

Wafer level package without sidewall cracking

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jianwen Xu, San Diego, CA (US);

Lizabeth Ann Keser, San Diego, CA (US);

William Stone, San Diego, CA (US);

Steve Joseph Bezuk, San Diego, CA (US);

Nicholas Ka Ming Yu, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/3185 (2013.01); H01L 23/49816 (2013.01); H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01);
Abstract

A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer. The molding compound may eliminate sidewall chipping and cracking as well as reduce the need for back side lamination.

Find Patent Forward Citations

Xu, Jianwen. (2016). Wafer level package without sidewall cracking (U.S. Patent No. 9318405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9318405

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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