The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Mar. 22, 2012
Applicants:
Michio Yaginuma, Tokyo, JP;
Shoichi Ito, Tokyo, JP;
Yoshitaka Ueno, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/082 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/18 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 71/12 (2006.01); C08J 5/24 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); C08G 59/40 (2006.01); B32B 15/14 (2006.01); C08L 71/02 (2006.01); C08G 73/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); C08G 59/4014 (2013.01); C08G 73/00 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08L 71/02 (2013.01); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2305/076 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2371/02 (2013.01); C08J 2375/04 (2013.01); H01L 2924/0002 (2013.01); H05K 3/022 (2013.01); H05K 2201/012 (2013.01);
Abstract
A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.