The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Oct. 24, 2013
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventor:

Hee Kwon Lee, Hwaseong-si, KR;

Assignee:

Samsung Display Co., Ltd., Giheung-Gu, Yongin-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 21/66 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); H01L 27/3276 (2013.01);
Abstract

A chip-on-film package includes a base film, a test line, and an integrated circuit chip. The base film includes a bent area in which a bending occurs. The test line is disposed on the base film, and at least a portion of the test line is overlapped with the bent area. The integrated circuit chip is disposed on the base film and includes a first terminal and a second terminal. The first terminal is connected to one end of the test line to output a first signal and the second terminal is connected to the other end of the test line to receive a second signal. The integrated circuit chip detects whether a crack occurs in the bent area based on a difference value in signal characteristics.


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