The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Oct. 14, 2013
Applicant:

Osram Opto Semiconductor Gmbh, Regensburg, DE;

Inventors:

Martin Brandl, Kelheim, DE;

Markus Boss, Regensburg, DE;

Markus Pindl, Tegernheim, DE;

Simon Jerebic, Tegernheim, DE;

Herbert Brunner, Sinzing, DE;

Tobias Gebuhr, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); H01L 31/0203 (2014.01); H01L 21/78 (2006.01); H01L 33/62 (2010.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 24/97 (2013.01); H01L 31/0203 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/85001 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.


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