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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9318352 B1

PDFFull Text
Expired
Date of Patent:
Apr. 19, 2016

Filed:

Aug. 22, 2013

Power module package and method for manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Gyunggi-do, KR;

Inventors:

Kwang Soo Kim, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Seog Moon Choi, Seoul, KR;

Jin Suk Son, Gyunggi-do, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;

Attorney:

Ladas & Parry, LLP

Primary Examiner:

Robert Bachner

Assistant Examiner:

Molly Reida

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 21/50 (2006.01); H01L 23/433 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 21/565 (2013.01); H01L 23/24 (2013.01); H01L 23/3107 (2013.01); H01L 23/4334 (2013.01); H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 25/072 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Find Patent Forward Citations

Kim, Kwang. (2016). Power module package and method for manufacturing the same (U.S. Patent No. 9318352). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9318352

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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