The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Dec. 11, 2014
Applicant:

Schreiner Group Gmbh & Co. KG, Oberschleissheim, DE;

Inventors:

Gerhard Hoelzl, Fahrenzhausen, DE;

Johannes Becker, Ilmmuenster, DE;

Assignee:

Schreiner Group GmbH & Co. KG, Oberschleissheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/02 (2006.01); G06K 19/077 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0776 (2013.01); B32B 37/12 (2013.01); B32B 37/24 (2013.01); B32B 38/10 (2013.01); G06K 19/02 (2013.01); G06K 19/07722 (2013.01); G06K 19/07771 (2013.01); B32B 2037/243 (2013.01); B32B 2307/306 (2013.01); B32B 2519/00 (2013.01); B32B 2519/02 (2013.01);
Abstract

A transponder label resistant to high temperatures includes a transponder arrangement, an adhesive layer for adhesively attaching the transponder label to an electrically conductive substrate, and a spacer layer on which the transponder arrangement is disposed, to space it apart from the conductive substrate. The adhesive layer and the spacer layer each have a material that is temperature-resistant, in such a manner that the size of a surface area of the transponder label, which area covers the conductive substrate after the transponder label is adhesively attached to the conductive substrate, remains unchanged when the transponder label, after having been adhesively attached to the conductive substrate, is heated from a starting temperature below 125° C. to a higher temperature between 125° C. and 400° C., and, after having been heated, is cooled down to the starting temperature.


Find Patent Forward Citations

Loading…