The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Apr. 04, 2014
Applicant:

Super Micro Computer Inc., San Jose, CA (US);

Inventors:

Lawrence K. W. Lam, San Jose, CA (US);

Ruei-Fu Weng, San Jose, CA (US);

Thompson Cheuk-Wai Tang, San Jose, CA (US);

Richard S. Chen, San Jose, CA (US);

Assignee:

SUPER MICRO COMPUTER INC., San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01); H05K 7/14 (2006.01); G11B 33/12 (2006.01); G11B 33/14 (2006.01);
U.S. Cl.
CPC ...
G06F 1/187 (2013.01); G06F 1/20 (2013.01); G11B 33/128 (2013.01); G11B 33/1426 (2013.01); H05K 7/1487 (2013.01); H05K 7/20154 (2013.01); H05K 7/20727 (2013.01);
Abstract

A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.


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