The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Apr. 29, 2013
Applicant:
Hewlett-packard Development Company, L.p., Fort Collins, CO (US);
Inventors:
Assignee:
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/14 (2006.01); H05K 9/00 (2006.01); H01B 9/06 (2006.01); F28F 7/00 (2006.01); G06F 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/182 (2013.01); G06F 1/20 (2013.01); G06F 1/206 (2013.01); H05K 7/2039 (2013.01); H05K 7/20154 (2013.01); H05K 9/0009 (2013.01); H05K 9/0041 (2013.01); H05K 7/20409 (2013.01); H05K 7/20436 (2013.01);
Abstract
An example provides an apparatus including a shielding panel in spaced relation to a substrate such that a heat sink mounted on the substrate protrudes through an opening in the shielding panel. A first airflow path may be provided between the substrate and a first side of the shielding panel, and a second airflow path may be provided on a second side of the shielding panel across a portion of the heat sink protruding through the opening.