The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Nov. 20, 2013
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Inventors:

Ju Tae Song, Hwaseong-si, KR;

Yeoun Kwan Sung, Suwon-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F02M 37/04 (2006.01); F02D 41/30 (2006.01); F02M 37/10 (2006.01); F02D 33/00 (2006.01);
U.S. Cl.
CPC ...
F02D 41/3082 (2013.01); F02D 33/003 (2013.01); F02M 37/103 (2013.01); F02D 2200/0602 (2013.01); F02D 2400/18 (2013.01); F02D 2700/0282 (2013.01); Y10T 137/8376 (2015.04);
Abstract

A controller integrated fuel pump module for a vehicle, may include a reservoir cup configured to be fixed to an interior of a fuel tank, a fuel pump installed in an interior of the reservoir cup to pump fuel introduced into the interior of the reservoir cup, and a flange for fixing the reservoir cup and the fuel pump to the fuel tank, wherein a receiving part may be formed to an outer surface of the flange and may include an inner space, and wherein a printed circuit board (PCB) assembly configured to mount devices of a controller to a PCB may be molded in the receiving part, in a state in which the PCB assembly may be received in the receiving part, and a molding portion surrounds the PCB assembly in the receiving part.


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