The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Nov. 20, 2006
Keigo Higaki, Tokyo, JP;
Keigo Higaki, Tokyo, JP;
Techno Polymer Co., Ltd., Tokyo, JP;
Abstract
The objective of the present invention is to provide a resin composition for direct plating whose plating performance such as depositibility and appearance after forming a metal film including copper film and the like by electroplating in direct plating method is excellent, a molded article comprising this composition, and a plated article having a metal film or an alloy film, formed by direct plating. The present composition is a thermoplastic resin composition containing a rubber-reinforced vinyl-based resin and the rubber-reinforced vinyl-based resin comprises a diene-based rubbery polymer [a1] and an ethylene•α-olefin-based rubbery polymer [a2], the total amount of the diene-based rubbery polymer [a1] and the ethylene•α-olefin-based rubbery polymer [a2] is from 3 to 30% by mass based on the thermoplastic resin composition, and the ratio of the ethylene•α-olefin-based rubbery polymer [a2] to the total amount is from 0.01 to 0.4.