The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Jul. 21, 2014
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Ji Yeon Lee, Uiwang-si, KR;
Sung Min Ko, Uiwang-si, KR;
Seong Ryong Nam, Uiwang-si, KR;
Se Il Oh, Uiwang-si, KR;
Seung Jib Choi, Uiwang-si, KR;
Kyoung Jin Ha, Uiwang-si, KR;
SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;
Abstract
A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more,Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)−(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)×100.  <Equation 1>