The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Feb. 17, 2013
Applicants:

Raymond Miller Karam, Santa Barbara, CA (US);

Georges Roussos, San Jose, CA (US);

Inventors:

Raymond Miller Karam, Santa Barbara, CA (US);

Georges Roussos, San Jose, CA (US);

Assignee:

Invenias Inc, Santa Barbara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); C03C 27/00 (2006.01); B29L 31/34 (2006.01); B29C 65/16 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
C03C 27/00 (2013.01); B29C 65/1635 (2013.01); B29C 66/112 (2013.01); B29C 66/114 (2013.01); B29C 66/53461 (2013.01); B29C 66/7465 (2013.01); B29C 66/97 (2013.01); B29L 2031/3481 (2013.01);
Abstract

Embodiments generally relate to methods for bonding a cap to a substrate. In one embodiment, the method comprises first providing a ring-cap assembly, comprising a cap and an interposer ring comprising a ring material transparent at an illumination wavelength. A peripheral portion of the ring projects outwards beyond the overlying cap. The portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers. The method further comprises positioning the ring-cap assembly so that the plurality of fingers directly overlies predetermined portions of the substrate top substrate, creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface, while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of that first bond.


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