The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jul. 22, 2011
Applicants:

Seiji Yamaguchi, Kiyosu, JP;

Koji Tasumi, Kiyosu, JP;

Hiroyuki Tajima, Kiyosu, JP;

Satoshi Wada, Kiyosu, JP;

Miki Moriyama, Kiyosu, JP;

Kazuya Aida, Urawa, JP;

Hiroki Watanabe, Urawa, JP;

Inventors:

Seiji Yamaguchi, Kiyosu, JP;

Koji Tasumi, Kiyosu, JP;

Hiroyuki Tajima, Kiyosu, JP;

Satoshi Wada, Kiyosu, JP;

Miki Moriyama, Kiyosu, JP;

Kazuya Aida, Urawa, JP;

Hiroki Watanabe, Urawa, JP;

Assignees:

TOYODA GOSEI CO., LTD., Kiyosu-shi, Aichi-ken, JP;

SUMITA OPTICAL GLASS, INC., Saitama-shi, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 27/00 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
C03C 27/00 (2013.01); H01L 33/56 (2013.01); H01L 2224/13 (2013.01); H01L 2933/005 (2013.01);
Abstract

A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.


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