The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
May. 15, 2012
Seh Kwang Lee, Yongin-si, KR;
Youn Chul Kim, Hwaseong-si, KR;
Joo Han Lee, Seongnam-si, KR;
Jae Kwang Choi, Suwon-si, KR;
Jae Phil Boo, Seongnam-si, KR;
Seh Kwang Lee, Yongin-si, KR;
Youn Chul Kim, Hwaseong-si, KR;
Joo Han Lee, Seongnam-si, KR;
Jae Kwang Choi, Suwon-si, KR;
Jae Phil Boo, Seongnam-si, KR;
EHWA DIAMOND INDUSTRIAL CO., LTD., Osan-Si, KR;
Abstract
This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.