The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Mar. 17, 2014
Applicant:

Nordson Corporation, Westlake, OH (US);

Inventors:

Alec J. Babiarz, Encinitas, CA (US);

Horatio Quinones, San Marcos, CA (US);

Thomas L. Ratledge, San Marcos, CA (US);

Jiangang Zhao, Concord, CA (US);

Assignee:

NORDSON CORPORATION, Westlake, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 37/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
B23K 37/00 (2013.01); H01L 21/563 (2013.01); H01L 24/27 (2013.01); H05K 13/0465 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/01029 (2013.01);
Abstract

Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.


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