The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9314879 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 19, 2016

Filed:

Dec. 16, 2011
Applicants:

Natsuki Kubo, Osaka, JP;

Eiji Iwamura, Kanagawa, JP;

Inventors:

Natsuki Kubo, Osaka, JP;

Eiji Iwamura, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); C22C 13/00 (2006.01); C22C 1/04 (2006.01); C22C 9/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/362 (2013.01); B23K 35/3615 (2013.01); C22C 1/0483 (2013.01); C22C 13/00 (2013.01); C22C 9/00 (2013.01);
Abstract

A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): HN—(CH)—X—(CH)—NH(wherein n represents an integer of 1 to 6 and X represents —NH—CHCH—NH— or a piperazine residue).


Find Patent Forward Citations

Kubo, Natsuki. (2016). Lead-free solder flux and lead-free solder paste (U.S. Patent No. 9314879). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9314879

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