The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Jul. 09, 2007
Applicants:

Russell A. Budd, North Salem, NY (US);

John P. Karidis, Ossining, NY (US);

Inventors:

Russell A. Budd, North Salem, NY (US);

John P. Karidis, Ossining, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/06 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0638 (2013.01); B23K 1/0016 (2013.01); B23K 3/0607 (2013.01); B23K 2201/40 (2013.01); H05K 2203/0126 (2013.01);
Abstract

A seal, fill head, and system are provided. The seal is adapted to cooperate with a fill head that is configured to place conductive bonding material into cavities on a mold. The seal comprises a first outer wall that is configured to abut a first adjacent wall of a support groove in a fill head. A second outer wall is configured to abut a second adjacent wall of a support groove in a fill head. An outer horizontal wall is situated between the first outer wall and the second outer wall. The outer horizontal wall comprises at least a first portion that is configured to abut an upper portion of the support groove. A convex bottom portion extends from the first and second outer walls. The convex bottom portion is configured to cooperate with a top surface of a mold.


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