The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Sep. 01, 2011
Applicants:

Ichiro Minami, Tokyo, JP;

Masajiro Sakurai, Yokosuka, JP;

Yasuo Suzuki, Chigasaki, JP;

Inventors:

Ichiro Minami, Tokyo, JP;

Masajiro Sakurai, Yokosuka, JP;

Yasuo Suzuki, Chigasaki, JP;

Assignee:

GTC Technology US LLC, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01F 3/04 (2006.01); B01D 3/32 (2006.01); B01J 19/32 (2006.01);
U.S. Cl.
CPC ...
B01D 3/32 (2013.01); B01F 3/04078 (2013.01); B01J 19/32 (2013.01); B01J 2219/3221 (2013.01); B01J 2219/32213 (2013.01); B01J 2219/32227 (2013.01); B01J 2219/32268 (2013.01); B01J 2219/32272 (2013.01); B01J 2219/32408 (2013.01);
Abstract

In existing structured packing, performance depends on effective contacting area. Performance decreases in cases having high surface tensions such mixtures containing a lot of water. Such mixtures are difficult to wet the packing surface. The present invention prevents liquid from intersecting the crease of the corrugation and from falling into a free space. Further, liquid flowing into the slot makes frequent liquid and vapor interfacial update resulting in positive utilization of the wetted area. The most important point of this invention is taking a positive utilization of the wetted area. The most important point of this invention is taking a large value of 3.5 or more of P/H (pitch/height of the crimp) and providing the horizontal slot on the crease, resulting in adding the flow reversal mechanism and frequent interfacial update.


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