The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Feb. 03, 2014
Applicant:

Google Inc., Mountain View, CA (US);

Inventors:

Michael Chi Kin Lau, San Francisco, CA (US);

Richard C. Bruns, San Francisco, CA (US);

Melanie Beauchemin, Mountain View, CA (US);

Assignee:

Google Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20718 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); H05K 7/20445 (2013.01); H05K 7/20727 (2013.01); H05K 7/20809 (2013.01); H01L 23/467 (2013.01); H01L 2924/0002 (2013.01); H05K 7/20163 (2013.01);
Abstract

A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.


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