The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Dec. 24, 2009
Sohei Samejima, Tokyo, JP;
Tsuyoshi Ozaki, Tokyo, JP;
Hiroyuki Osuga, Tokyo, JP;
Teruhiko Kumada, Tokyo, JP;
Sohei Samejima, Tokyo, JP;
Tsuyoshi Ozaki, Tokyo, JP;
Hiroyuki Osuga, Tokyo, JP;
Teruhiko Kumada, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A method of manufacturing a printed wiring board () includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (); forming a first adhesive member () on a lower surface of the core to cover the primary through hole (); charging an insulating member into the primary through hole (); forming a second adhesive member () on an upper surface of the core; forming a third adhesive member () below the first adhesive member (); forming a fourth adhesive member () on the second adhesive member (); and forming interconnections on the core.