The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Mar. 06, 2014
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 7/00 (2006.01); H05K 1/14 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H05K 3/34 (2006.01); H01G 2/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H01G 2/065 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 3/3442 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/2045 (2013.01); Y02P 70/613 (2015.11);
Abstract
An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted.