The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Feb. 26, 2013
Qualcomm Incorporated, San Diego, CA (US);
Christopher J. Healy, San Diego, CA (US);
Gopal C. Jha, San Diego, CA (US);
Manuel Aldrete, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets entrapped in through mold vias, during the manufacturing process, while also reducing the risk of solder shorts between adjacent solder balls located in the through mold vias. Additionally, MLP packages which include gutters integrally connected to one or more through mold vias may enable tighter bump pitch and thinner packages. As a result, process margins and risks associated with surface mount technology (SMT) may be improved and provide more flexibility on inventory staging.