The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Aug. 26, 2011
Applicants:
Terukazu Ihara, Ibaraki, JP;
Naohiro Terada, Ibaraki, JP;
Inventors:
Terukazu Ihara, Ibaraki, JP;
Naohiro Terada, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G11B 5/48 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0269 (2013.01); G11B 5/486 (2013.01); H05K 3/0097 (2013.01); Y10T 29/49126 (2015.01);
Abstract
A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other.