The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Mar. 12, 2014
Applicant:

Robert Clark Woodward, Jr., Cambridge, MA (US);

Inventor:

Robert Clark Woodward, Jr., Cambridge, MA (US);

Assignee:

DOBLE ENGINEERING COMPANY, Watertown, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0254 (2013.01); H05K 1/0298 (2013.01); H05K 1/162 (2013.01);
Abstract

A method for mitigating voltage stress on a PCB includes applying AC voltage to a multi-terminal condenser structure of a multi-layered PCB. The terminal condenser structure is formed by overlapping a plurality of conductive traces between board layers of the multi-layered PCB. A corresponding dielectric layer is disposed between the overlapping conductive traces of the board layers. The overlapping conductive traces include a first terminal, a second terminal, a third terminal, and a fourth terminal. The first terminal and the third terminal are disposed on a first layer of the multi-layered PCB, and the second terminal and the fourth terminal are disposed on a bottom layer of the multi-layered PCB. The first terminal and the second terminal are connected to a ground point, and the third terminal and the fourth terminal are connected to the AC voltage. Voltage stresses on the PCB are mitigated utilizing the multi-terminal condenser structure.


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