The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Oct. 10, 2013
Applicant:

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Inventors:

Kiyotaka Itsuki, Yokkaichi, JP;

Hiroyuki Matsuoka, Yokkaichi, JP;

Tomokazu Kashiwada, Yokkaichi, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/52 (2006.01); H01R 13/6581 (2011.01); H01R 13/6593 (2011.01); H01R 103/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5202 (2013.01); H01R 13/5208 (2013.01); H01R 13/6581 (2013.01); H01R 13/6593 (2013.01); H01R 2103/00 (2013.01);
Abstract

A shield connector () to be connected to a device-side connector () provided on a device includes female terminals () to be connected to device-side terminals () provided in the device-side connector (), a housing main body () including a wire pull-out hole () from which outer wires () connected to the female terminals () are pulled out, a shield shell () to be connected to a shield case () of the device while covering the housing main body (), and a resin molded body () held in close contact with the outer peripheral surfaces of the outer wires (). The resin molded body () is vertically sandwiched by an opening edge portion (A) of the wire pull-out hole () in the housing main body () and a shell-side holding portion () provided on the shield shell ().


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