The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Mar. 24, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Naoki Hirao, Kanagawa, JP;
Hiroyuki Hosono, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/24 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/82001 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01);
Abstract
A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided.