The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Nov. 12, 2013
Applicant:

Dow Corning Corporation, Midland, MI (US);

Inventors:

Mark Fisher, Midland, MI (US);

Don Juen, Sanford, MI (US);

Barry Ketola, Freeland, MI (US);

Nick Shephard, Midland, MI (US);

Assignee:

DOW CORNING CORPORATION, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/048 (2014.01); C08L 83/04 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); H01L 31/18 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0481 (2013.01); B32B 37/1009 (2013.01); B32B 37/1292 (2013.01); B32B 37/18 (2013.01); C08L 83/04 (2013.01); H01L 31/048 (2013.01); H01L 31/18 (2013.01); B32B 2037/1253 (2013.01); B32B 2307/20 (2013.01); B32B 2307/40 (2013.01); B32B 2457/12 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); Y02E 10/50 (2013.01);
Abstract

An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain. During lamination, the curable silicone composition cures to form the silicone encapsulant and air escapes from through the at least one passage.


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