The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Feb. 19, 2015
Applicant:

Omron Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Tsuyoshi Miyata, Ayabe, JP;

Kazuya Ohtsuki, Fukuchiyama, JP;

Jun Nakajima, Ayabe, JP;

Seiji Miyashita, Fukuchiyama, JP;

Kiyoshi Imai, Ayabe, JP;

Assignee:

OMRON Corporation, Kyoto-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/167 (2006.01); H01L 31/0224 (2006.01); H01L 31/14 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 31/0224 (2013.01); H01L 31/14 (2013.01); H01L 31/167 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/181 (2013.01);
Abstract

A photosensor includes an emitter element, an emitter-encapsulating portion, a receiver element, a receiver-encapsulating portion, a circuit portion, and a circuit-encapsulating portion. The emitter-encapsulating portion encapsulates the emitter element. The receiver-encapsulating portion encapsulates the receiver element. The circuit portion includes a luminous element for indicating an operation. The circuit-encapsulating portion encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator portion facing the luminous element. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are formed from the same resin material containing a light diffusing agent.


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