The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Oct. 23, 2014
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Sang-moon Lee, Yongin-si, KR;

Young-jin Cho, Yongin-si, KR;

Assignee:

Samsung Electronics Co. LTD, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/12 (2006.01); H01L 21/337 (2006.01); H01L 21/00 (2006.01); H01L 29/78 (2006.01); H01L 29/15 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/06 (2006.01); H01L 29/205 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 29/0657 (2013.01); H01L 29/1075 (2013.01); H01L 29/1079 (2013.01); H01L 29/15 (2013.01); H01L 29/205 (2013.01); H01L 29/66462 (2013.01); H01L 29/7781 (2013.01); H01L 29/7783 (2013.01); H01L 29/517 (2013.01);
Abstract

Semiconductor devices including a substrate (e.g., silicon substrate), a multi-layer structure disposed on a portion of the substrate, and at least one electrode disposed on the multi-layer structure and methods of manufacturing the same are provided. The multi-layer structure may include an active layer containing a Group III-V material and a current blocking layer disposed between the substrate and the active layer. The semiconductor device may further include a buffer layer disposed between the substrate and the active layer. In a case that the substrate is a p-type, the buffer layer may be an n-type material layer and the current blocking layer may be a p-type material layer. The current blocking layer may contain a Group III-V material. A mask layer having an opening may be disposed on the substrate so that the multi-layer structure may be disposed on the portion of the substrate exposed by the opening.


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