The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Jul. 01, 2014
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventor:
Seiichi Aritome, Gyeonggi-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 25/065 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 23/532 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 5/025 (2013.01); G11C 5/063 (2013.01); H01L 23/481 (2013.01); H01L 23/525 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06572 (2013.01);
Abstract
A semiconductor device includes an operation circuit formed on a top surface of a semiconductor substrate, a memory array formed over the operation circuit, an inner pad group formed on an intermediate layer between the operation circuit and the memory array and coupled to the operation circuit, a first outer pad group formed on a bottom surface of the semiconductor substrate, and a wiring structure passing through the semiconductor substrate, and coupling the inner pad group to the first outer pad group.