The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Feb. 20, 2014
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 25/16 (2006.01); H01L 23/538 (2006.01); H01Q 1/22 (2006.01); H01Q 23/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/50 (2013.01); H01L 23/5386 (2013.01); H01L 24/06 (2013.01); H01L 25/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 23/00 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a discrete element part. The first semiconductor chip is arranged on the substrate and includes a first electrode group. The second semiconductor chip is arranged on the substrate and includes a second electrode group, at least one of electrodes included in the second electrode group being connected to at least one of electrodes included in the first electrode group via at least one bonding wire. The discrete element part is arranged on the substrate and under the at least one bonding wire.