The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

May. 27, 2013
Applicant:

Nsk Ltd., Shinagawa-ku, Tokyo, JP;

Inventors:

Takashi Sunaga, Tokyo, JP;

Noboru Kaneko, Tokyo, JP;

Osamu Miyoshi, Tokyo, JP;

Assignee:

NSK Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 29/78 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/43 (2013.01); H01L 24/37 (2013.01); H01L 24/41 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 29/78 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/35 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/352 (2013.01); H01L 2224/35847 (2013.01); H01L 2224/3701 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40475 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/4103 (2013.01); H01L 2224/4112 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/494 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84424 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/85 (2013.01); H01L 2224/85815 (2013.01); H01L 2224/9221 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3701 (2013.01);
Abstract

There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.


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