The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
May. 08, 2015
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventor:
Hyeong Seok Choi, Seoul, KR;
Assignee:
SK hynix Inc., Icheon-si Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 25/04 (2014.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 25/03 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 23/482 (2013.01); H01L 24/17 (2013.01); H01L 25/04 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 25/03 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/1705 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/182 (2013.01);
Abstract
A conductive bump includes a step member formed to form a step on a portion of a connection pad; and a conductive member formed on the connection pad and the step member and having an inclined surface which is inclined with respect to the connection pad.