The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Jun. 15, 2012
Applicants:
Nobuhito Ito, Saitama, JP;
Masao Arima, Saitama, JP;
Inventors:
Nobuhito Ito, Saitama, JP;
Masao Arima, Saitama, JP;
Assignee:
TAIYO INK MFG. CO., LTD., Saitama, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/42 (2006.01); C08L 61/14 (2006.01); C08L 63/10 (2006.01); H05K 1/09 (2006.01); G03F 7/038 (2006.01); H05K 3/28 (2006.01); C08F 287/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0384 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08F 287/00 (2013.01); C08L 61/14 (2013.01); C08L 63/10 (2013.01); G03F 7/038 (2013.01); G03F 7/0388 (2013.01); H05K 3/287 (2013.01); H05K 2201/0166 (2013.01);
Abstract
Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.