The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

May. 18, 2012
Applicants:

Kohei Yano, Tokyo, JP;

Daiki Yamashita, Tokyo, JP;

Inventors:

Kohei Yano, Tokyo, JP;

Daiki Yamashita, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/64 (2012.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
G03F 1/64 (2013.01); C09J 133/08 (2013.01);
Abstract

To provide a pellicle having a an adhesive, wherein adhesive residue is decreased at the time of peeling the pellicle from a mask after lithographic exposure and outgassing from the adhesive is suppressed The pellicle according to the present invention is a pellicle comprising a pellicle frame, a tensioned pellicle film placed on one end surface of the pellicle frame and an adhesive applied to the other end surface thereof, in which the adhesive contains a (meth)acrylic alkyl ester copolymer and a silane compound, and the (meth)acrylic alkyl ester copolymer is a copolymer of a (meth)acrylic alkyl ester having an alkyl group of 4 to 14 carbon atoms and a monomer having a functional group reactive to at least either one of an isocyanate group or an epoxy group.


Find Patent Forward Citations

Yano, Kohei. (2016). Pellicle, pressure-sensitive adhesive for pellicle, photomask with pellicle, and method for manufacturing semiconductor device (U.S. Patent No. 9310673). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9310673

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