The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Sep. 18, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Jun Murata, Osaka, JP;

Takamasa Tamura, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 27/00 (2006.01); G02B 1/118 (2015.01); G02B 3/08 (2006.01); B29D 11/00 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
G02B 1/118 (2013.01); B29D 11/0074 (2013.01); B29D 11/00326 (2013.01); G02B 3/08 (2013.01); B29D 11/00009 (2013.01); B29D 11/0048 (2013.01); B29D 11/0049 (2013.01); B29D 11/00336 (2013.01); B29D 11/00346 (2013.01); B29D 11/00413 (2013.01); B29L 2011/0016 (2013.01);
Abstract

A method for manufacturing a lens which includes raised portions arranged on a surface of the lens with a pitch smaller than or equal to a predetermined pitch, and is configured to reduce reflection of light having a wavelength longer than or equal to the predetermined pitch includes preparing a molding die in which recessed portions corresponding to the raised portions are formed, filling a molten resin material into a cavity of the molding die via a gate, and curing the resin material in the molding die. The molding die includes a peripheral region in a periphery of the gate, and an adjacent region adjacent to the peripheral region. First recessed portions in the peripheral region are deeper than second recessed portions in the adjacent region.


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