The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Sep. 25, 2012
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Theodoros E. Anemikos, Milton, VT (US);

Douglas S. Dewey, Highgate, VT (US);

Pascal A. Nsame, Essex Junction, VT (US);

Anthony D. Polson, Jericho, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06G 7/54 (2006.01); G01R 31/28 (2006.01); G01R 31/30 (2006.01); G11C 29/06 (2006.01); G11C 29/12 (2006.01); G11C 11/412 (2006.01); G11C 29/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2856 (2013.01); G01R 31/3004 (2013.01); G11C 29/06 (2013.01); G11C 29/12005 (2013.01); G01R 31/2872 (2013.01); G01R 31/2894 (2013.01); G11C 11/412 (2013.01); G11C 2029/0401 (2013.01); G11C 2029/0409 (2013.01);
Abstract

Disclosed is an integrated circuit (IC) chip with a built-in self-test (BIST) architecture that allows for in the field accelerated stress testing. The IC chip can comprise an embedded processor, which selectively alternates operation of an on-chip test block between a stress mode and a test mode whenever the IC chip is powered-on such that, during the stress mode, the test block operates at a higher voltage level than an on-chip functional block and such that, during the test mode, the test block operates at a same voltage level as the functional block and is subjected to testing. Also disclosed are a system, method and computer program product which access the results of such testing from IC chips in a variety of different types of products in order model IC chip performance degradation and to generate IC chip end of life predictions specific to the different types of products.


Find Patent Forward Citations

Loading…