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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9310057 B1

PDFFull Text
Date of Patent:
Apr. 12, 2016

Filed:

Dec. 06, 2011

Lighting apparatus

Applicants:

Philipp Helbig, Heidenheim, DE;

Oliver Hering, Niederstotzingen, DE;

Inventors:

Philipp Helbig, Heidenheim, DE;

Oliver Hering, Niederstotzingen, DE;

Assignee:

OSRAM GMBH, Munich, DE;

Attorney:

Viering,Jentschura&Partner mbB

Primary Examiner:

Elmito Breval

Assistant Examiner:

Matthew Peerce

Int. Cl.
CPC ...
B60Q 1/00 (2006.01); F21V 21/00 (2006.01); F21S 8/10 (2006.01); F21V 7/06 (2006.01); F21V 8/00 (2006.01); F21V 29/70 (2015.01); F21K 99/00 (2010.01); F21V 7/00 (2006.01); F21V 29/00 (2015.01); F21Y 101/02 (2006.01); F21Y 113/00 (2006.01); F21Y 113/02 (2006.01);
U.S. Cl.
CPC ...
F21V 21/00 (2013.01); F21S 48/1104 (2013.01); F21S 48/115 (2013.01); F21S 48/1109 (2013.01); F21S 48/1154 (2013.01); F21S 48/1159 (2013.01); F21S 48/1241 (2013.01); F21V 7/06 (2013.01); F21V 29/70 (2015.01); G02B 6/0001 (2013.01); F21K 9/30 (2013.01); F21S 48/328 (2013.01); F21V 7/0008 (2013.01); F21V 29/004 (2013.01); F21V 29/2212 (2013.01); F21Y 2101/02 (2013.01); F21Y 2113/00 (2013.01); F21Y 2113/02 (2013.01);
Abstract

A lighting apparatus includes semiconductor light sources and a heat sink for the semiconductor light sources, wherein the lighting apparatus has a carrier element for at least one first group and one second group of luminous elements, said carrier element being connected to the heat sink and projecting from a side of the heat sink, and wherein the first group and second group of luminous elements are arranged on surface regions of the carrier element and in each case comprise at least one semiconductor light source, wherein a further group of luminous elements is arranged at the side of the heat sink from which the carrier element projects, and the further group of luminous elements comprises at least one semiconductor light source.

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