The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Sep. 30, 2013
Applicant:

Air Products and Chemicals Inc., Allentown, PA (US);

Inventors:

Pritesh G. Patel, Breinigsville, PA (US);

Edze Jan Tijsma, Zeist, NL;

Assignee:

Air Products and Chemicals, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01); C08K 7/14 (2006.01); C08K 5/16 (2006.01); C08K 7/02 (2006.01); C08K 7/06 (2006.01); C08L 1/02 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
C08K 7/14 (2013.01); C08G 59/50 (2013.01); C08G 59/56 (2013.01); C08K 5/16 (2013.01); C08K 7/02 (2013.01); C08K 7/06 (2013.01); C08L 1/02 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01);
Abstract

An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.


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